Microsystems Technology and Science Lab Facility

The Microsystems Technology and Science (MSTS) Laboratory in the Department of Mechanical Engineering at the University of Michigan is available full-time for the device characterization and thin-film polymer thermal characterization in the proposed research. The MSTS Lab is a research laboratory containing a 600 square foot space and solely dedicated to Dr. Kurabayashi’s research activities in the Mechanical Engineering Department that address electromechanical and thermomechanical phenomena occurring at micro- and nano-meter scales. The equipment available at the MSTL includes a microprobe station with a 100 mm working distance, a vibration control system, a thermal oven, workbenches, a large-band-width digital signal analyzer, high-voltage power supply, and laser optics.

The University of Michigan Lurie Nanofabrication Facility (LNF)

All silicon micromachining to fabricate the testing devices will be performed at the Lurie Nanofabrication Facility (LNF) located in the Department of Electrical Engineering and Computer Science at University of Michigan.  The MNF belongs to the National Nanotechnology Infrastructure Network (NNIN) supported by the NSF. The LNF is internationally recognized as a leader in microelectronics research and optoelectronics, with major research thrusts in integrated sensors, automated semiconductor manufacturing, compound semiconductor materials, and ultra-high-speed microwave and millimeter-wave devices.  The LNF facility contains a 6000 square foot clean room for microelectronics processing, a 10,000 square foot teaching lab for training undergraduate and graduate students specializing in these areas, and a testing room for characterizing the performance of fabricated devices. Within the LNF complete facilities exist for solid-state device and circuit fabrication. These facilities include equipment for mask making, photolithography, oxidation and diffusion, dry pattern transfer (plasma, RIE), ion-beam deposition and milling, vacuum evaporation and sputtering, chemical vapor deposition, and molecular-beam epitaxy.  The electrical performance of the testing device will be characterized in the device testing room, which contains facilities for the characterization of III-V semiconducting materials, high-performance silicon-gate NMOS circuits, submicron-gate HEMT, and MESFET structures.  Instrumentation exists in the Laboratory for device characterization up to 350 GHz. In addition, a full-field interferometer (Zygo New View 5000) is available for characterizing the structural deformation of fabricated MEMS devices.

University of Michigan Electron Microbeam Analysis Lab Facility
The in-situ and ex-situ microstructural characterization of the device materials will be performed at the University of Michigan Electron Microbeam Analysis Laboratory (EMAL) located in the west basement of the Space Research Building. The EMAL is a university-wide user facility for the microstructural and microchemical characterization of solid materials. The laboratory provides and maintains state-of-the-art equipment for use by the university research community. The equipment available at the EMAL includes Atomic Force/Scanning Probe Microscopy, X-ray Energy Dispersive Spectroscopy (XEDS), Electron Energy Loss Spectroscopy (EELS), Selected Area Electron Diffraction (SAED), Convergent Beam Electron Diffraction (CBED), Scanning Transmission Electron Microscopy (STEM), and Scanning Electron Microscopy (SEM). Of particular importance for the proposed project are the Polymers Characterization and Processing Facilities at EMAL. Theses facilities include three Tian-Calvert microcalorimeters, two Perkin-Elmer DSC-7 differential scanning calorimeters, and a General Radio dielectric spectrometer. These equipments are available for material characterization for the proposed polymer/silicon hybrid photonics MEMS devices.

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